Members

Principal Investigator (PI)
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Dr. Chase C. Cao

Assistant Professor & Director

Laboratory for Soft Machines & Electronics

Department of Mechanical and Aerospace Engineering
Case Western Reserve University

Email: ccao@case.edu

​Associate Editor, IEEE Robotics and Automation Letters (RA-L) 

Guest Editor & Editorial Board Member, Forces in Mechanics (Elsevier)

Postdoc Associates & Visiting Scholars
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Y. Pang

Postdoc Associate

Research Interests: Flexible and wearable electronics, Energy harvesting

PhD School: Chinese Academy of Sciences

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L. Zhang

Visiting Professor

Research Interest: Solid mechanics, Biomechanics, Metamaterials

PhD School: Tsinghua University

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B. Tian

Visiting PhD Student

Research Interest: Printed electronics & energy devices

PhD School: Wuhan University

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X. Xu

Postdoc Associate

Research Interest: Multifunctional metamaterials, Solid mechanics

PhD School: University of Missouri-Columbia 

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Z. Chen

Visiting PhD Student

Research Interest: Smart materials,  Soft actuators, Soft robots 

PhD School: Shanghai Jiao Tong University

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Openings

for Postdoc & Visiting Scholar

Research topics: Soft robotics, Soft electronics, Metamaterials, Solid mechanics, 3D/4D printing

Graduate Students
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Z. Huang

PhD Student

Research Interests: Computational mechanics, Additive manufacturing, Printed electronics 

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S. Chen

PhD Student

Research Interests: Soft robots, Soft materials

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Y. Chu

PhD Student

Research Interest: Printed Electronics

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Openings

for PhD Students

Research topics: Soft robotics, Soft electronics, Metamaterials, Solid mechanics, 3D/4D printing

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Openings

for MS Students

Research topics: Soft robotics, Soft electronics, Metamaterials, Solid mechanics, 3D/4D printing

Undergradutes
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Samuel Rabick

Undergraduate Student

Research Interests: Soft electronics, Soft robots

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S. Shin

Undergraduate Student

Research Interest: 3D/4D Printing

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Catherine Cook

Undergraduate Student

Research Interest: Nanocomposites

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Openings

for Undergraduate (SOURCE)

Research Topics: Soft robotics, Soft electronics, IoTs, Energy harvesting, 3D/4D printing, Metamaterials, etc.